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 MBRS130T3
Preferred Device
Surface Mount Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system.
Features http://onsemi.com
* * * * * * *
Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop (0.6 Volts Max @ 1.0 A, TJ = 25C) Excellent Ability to Withstand Reverse Avalanche Energy Transients Guardring for Stress Protection Pb-Free Package is Available
SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 30 VOLTS
SMB CASE 403A PLASTIC
Mechanical Characteristics
* Case: Epoxy, Molded * Weight: 95 mg (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Lead and Mounting Surface Temperature for Soldering Purposes: * *
260C Max. for 10 Seconds Shipped in 12 mm Tape and Reel, 2500 units per reel Cathode Polarity Band Leads are Readily Solderable
MARKING DIAGRAM
AYWW B13G G
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (TL = 115C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction Temperature Symbol VRRM VRWM VR IF(AV) IFSM Value 30 Unit V
A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
1.0 40 A A Device MBRS130T3 MBRS130T3G Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel
TJ
-65 to +125
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
THERMAL CHARACTERISTICS
Rating Thermal Resistance, Junction-to-Lead (TL = 25C) Symbol RqJL Value 12 Unit C/W
(c) Semiconductor Components Industries, LLC, 2007
1
August, 2007 - Rev. 7
Publication Order Number: MBRS130T3/D
MBRS130T3
ELECTRICAL CHARACTERISTICS
Rating Maximum Instantaneous Forward Voltage (Note 1) (iF = 1.0 A, TJ = 25C) Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 100C) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 100 50 30 20 10 5 3 2 1 0.5 0.3 0.2 0.1 0.05 0.03 0.02 0.01 Symbol VF iR 1.0 10 Value 0.6 Unit V mA
1 0.7 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02 0.1
I R , REVERSE CURRENT (mA)
TC = 100C
TJ = 125C 100C 75C
25C
TC = 25C
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
0
4
8
12
16
20
24
28
32
36
40
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
200 180 160 C, CAPACITANCE (pF) 140 120 100 80 60 40 20 0 0 4 8 12 16 20 24 28
Figure 2. Typical Reverse Current
NOTE: TYPICAL CAPACITANCE AT 0 V = 160 pF
32
36
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
10 9 8 7 6 5 4 3 2 1 0 30 40 50 60 70 80 90 100 TC, CASE TEMPERATURE (C) 110 120 130
DC SQUARE WAVE
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
5 TJ = 125C 4 5 CAPACITANCE LOAD 2 1 0 IPK IAV = 20 SQUARE WAVE
DC
RATED VOLTAGE APPLIED RqJC = 12C/W TJ = 125C
3 10
0
1
2
3
4
5
Figure 4. Current Derating (Case) http://onsemi.com
2
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Power Dissipation
MBRS130T3
PACKAGE DIMENSIONS
SMB CASE 403A-03 ISSUE F
HE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF
b
D
DIM A A1 b c D E HE L L1
MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76
MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030
MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261 0.089
2.743 0.108
2.159 0.085
SCALE 8:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P Box 5163, Denver, Colorado 80217 USA .O. Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
3
MBRS130T3/D


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